Material composition and localized heat generation effects on conjugate heat removal from electronic components
journal contributionposted on 01.01.1994 by Cristina H. Amon, Jay S. Nigen, Carnegie Mellon University.Engineering Design Research Center.
Any type of content formally published in an academic journal, usually following a peer-review process.
Abstract: "A time-dependent conjugate conduction/convection numerical study of four electronic component configurations that differ in material composition and distribution of internal heat generation is conducted in parallel PCBs (Printed Circuit Boards) for laminar and transitional Reynolds numbers. Both material composition and concentration of heat generation are found to affect the spatial distribution of temperature, heat flux, and Nusselt number along the solid-fluid interface. Furthermore, it is found that the distribution of internal heat generation strongly affects the convective resistance at the solid-fluid interface of the component. This leads, for the configurations with local heat generation, to a non-monotonic relationship between the convective heat transport and the Reynolds number for the range of parameters investigated. It is found that conjugate heat transfer can significantly affect the temperature distribution."